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Coating Machine
3D printing digital encapsulation and coating equipment
The 3D printing digital packaging coating equipment innovatively integrates 3D printing technology into the field of electronic packaging protection. It is a new generation of packaging protection equipment specially designed for electronic components such as PCBA and FPC. The equipment uses UV glue as the forming base material. Through precise spraying and multi-layer stacking technology, it builds a customized 3D protective structure in the component protection area, achieving high-strength and highly adaptable electronic packaging protection. It overturns the traditional coating process and meets the high-precision and high-efficiency electronic manufacturing production requirements.
PRODUCT DETAIL

Feature:

1.3D digital packaging technology

Based on the full-area image processing logic, it accurately identifies the protected areas and no-coating areas of components, achieving selective and precise packaging without the need for pre-masking or post-masking, thereby enhancing packaging efficiency from the source of the process.
2. Array jetting technology
Equipped with industrial-grade array nozzles, it integrates over 4,000 precise and independently controllable spray holes. It can flexibly construct 2D/3D protection structures according to protection requirements, and is suitable for diversified packaging requirements of different components.
3. Synchronous curing technology
Equipped with a water-cooled dual-head UV LED curing system, it enables immediate curing upon spraying. The UV adhesive cures immediately after spraying, avoiding coating sagging and accumulation, and ensuring the forming accuracy of the protective structure.


Product advantage:

1. Precise packaging, no need for masking

The minimum wire diameter can reach 0.1mm, and the φ1mm tiny test points can be precisely avoided. The no-coating safety distance is as low as 0.2mm. Even for high-density PCBA with closely arranged components, it can achieve error-free and precise packaging, completely eliminating the problem of mispackaging.
2. Precise thickness control and multi-layer stacking are available
The single-layer packaging thickness can be freely set at 20/40/80μm, and the maximum thickness of multi-layer stacking can reach 3mm. The coating layer is uniform and the thickness is controllable, meeting the protection thickness requirements in different scenarios.
3. Super strong protection, significantly increases the thickness of the pin paint film. Curing while printing reduces the glue flow time, which is conducive to increasing the thickness of the paint film at the component pins.
4. Green and efficient, with a faster printing speed
The scanning and printing speed is fast, with efficiency reaching 2 to 3 times that of traditional spraying, significantly saving time. The single scanning area is large, effectively reducing the time consumption of path movement.


Key Technician:

The self-developed glue system is deeply coordinated with the equipment

◆ Full-area image processing eliminates cumbersome procedures such as masking
It is faster compared with the traditional coating process
The 3D stereoscopic stacking forming is conducive to increasing the thickness of the paint film on the pins of components
The array precision nozzle has thousands of independently controllable spray holes


Image:

Specification:

Category Item Details Remarks
Package thickness/speed The single-layer package thickness 20/40/80μm Adjustable
The thickness of multi-layer packaging reach 3mm of the total thickness the total thickness of multi-layer stacking
The fastest single-layer packaging speed 15s 350*350 mm
Parameter Number of motion axes 3



-
Moving speed (XY) 200/300/400 mm/slow/Medium/high speed -
Accuracy Precision packaging accuracy ±0.1 mm -
Repeatability accuracy ±0.02 mm -
Working range: X-axis, Y-axis, maximum working surface 350*350 mm 3kg -
PCBA character The maximum size of PCBA 350*350 mm -
元件最大高度 The recommended maximum height of the component is ≤ 20mm -
System control software system Windows operating system Win10 -
Power supply 220V/50/60Hz -
The ambient temperature range 18-28℃ -
Compressed air 0.6Mpa above -
Relative air humidity 30-60%RH -
The equipment dimensions length, width and height 1120*1520*1740 mm -
Weight 690 kg -
The main component Nozzle the industrial piezoelectric nozzle -
The visual positioning system 5 million pixels and a high-precision telecentric lens -
Drive motor (X/Y/Z) XYZ axis servo motor -
The rubber circuit system independent double circulation rubber circuit -
glue curing system Double-headed UV LED -
motion Precision linear guide rails -
Track data The speed transmission 2-10 m/min -
The edge space of the PCB ≥5mm -
The conveying height 900±20 mm -
Applicable material characteristics Viscosity 20-40cps working temperature30℃~55℃
Surface tension 25-32dyn/cm -
Particle size D90≤300 nm -
P H value 6-8 -
Curing method U V curing -




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