●12-section temperature control, which is in accordance with the lead-free repair process.
●The temperature curve can be analyzed and reported automatically. The origin can be traced if it has an exceptional quality problem.
●Mass temperature parameters can be stored. It is very convenient to obtain the history parameters.
●It has a high-definition optical alignment system which can move forward and back;up and down automatically.You can inspect the edge of BGA all directions and mount the component accurately.
|
Power Supply: |
AC 380V±10% 50/60 Hz |
|
Total Power: |
9.85KW(Max) |
|
Power of Top Hot Air Heater: |
1450 W |
|
Power of Bottom Hot Air Heater: |
1200 W |
|
Power of IR pre-heater: |
6600 W |
|
Other |
600 W |
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Temperature Error: |
±1℃ |
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Placement Accuracy: |
±0.01mm |
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Placement Pressure: |
＜0.2N |
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Hot Air Heating Temperature: |
400℃（Max） |
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PCB Size: |
635*520mm (Max);6*6mm (Min) |
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BGA Chip Size: |
80*80mm (Max);2*2mm (Min) |
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Control system: |
Industrial PC+ Motion control system |
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Dimension: |
L835*W960*H1640mm |
|
Sensor: |
5 pcs |
|
Net Weight: |
About 218.5kg |
|
Color: |
White/Red |
